January 16, 2025 - 21:53
Nvidia's CEO, Jensen Huang, recently addressed the company's ongoing demand for advanced packaging technology from TSMC, emphasizing that while the need remains robust, the specific requirements are evolving. During a discussion, Huang clarified that Nvidia is not reducing orders but rather adapting to the changing landscape of technology.
The company's flagship AI chip, Blackwell, showcases the innovative use of multiple chips interconnected through a sophisticated chip on wafer on substrate (CoWoS) packaging method. This technology, provided by Taiwan Semiconductor Manufacturing Co (TSMC), plays a crucial role in enhancing the performance and efficiency of Nvidia's AI solutions.
As the AI industry continues to grow, Nvidia is at the forefront of leveraging advanced packaging to meet the demands of increasingly complex applications. Huang's comments highlight the dynamic nature of the semiconductor market, where adaptability and innovation are key to maintaining a competitive edge.
